Microsoft has announced a new advancement in thermal management technology designed specifically for AI chips and data centers. This innovation focuses on significantly reducing heat generated by these processors. Preliminary tests indicate the technology will lower operating temperatures, potentially leading to substantial energy savings. The enhanced cooling solution could facilitate increased processing power within existing data center infrastructure, allowing for greater density and improved performance. The technology’s development is expected to have implications for the future of data center design and operations.
Credits: Latest from TechRadar